Application
This package can support connections to high-density flip chips with many terminals, such as MPU.

Features

• A film-type resin material that has high reliability and high-quality stability and can be stably supplied is used.
• It can support the finer and high-density design rules that may appear during the next few generations.

Application
This package with pins can support connection to high-density flip chips with many terminals, such as MPU.

Material
The main body is an organic build-up substrate, and a lead terminal made of a Cu alloy or an alloy of iron, nickel, and cobalt is welded to the substrate.

Features
Because pins with many terminals are welded uniformly, the product is highly reliable and easy to handle.