SHP’s standard hermetic headers have been designed to provide reliable service in aluminum housings over the full temperature range of –65°C to 150°C. Greater pin counts can be provided dependent on host housing material and specific temperature range requirements.
The design of these headers, when combined with the recommended application data, provides a complete solution for header requirements. An optimum solder joint is assured, providing a life of reliable hermetic performance.
An optimized solder well is provided to accommodate variations in solder demand as a result of manufacturing tolerances.

Спецификации:

• Designed to MIL-F-15733 

• Material - Steel
• Insulation - Glass
• Maximum Temperature - 250°C
• DWV (pin to ground) - 500
• DWV (Cap) - 50 VDC (higher available)
• Capacitance - up to 10,000 pF GMV (+ 100% / - 0)
• Insulation Resistance - 1,000 meg ohm-mfd @ 25°C
• Dissipation Factor - Less than 3%
• Finish - 50 microinches minimum GOLD per MIL-G-45204, Type III, Grade A over 200-400 microinches NICKEL per MIL-C-26074
• Leak Rate - Less than 1 X 10-8 cc/sec @ 1 ATM (He).

Guidelines for the Use of Hermetic Headers